Javascript DHTML Drop Down Menu Powered by dhtml-menu-builder.com
AL Aluminum Metallized Polyimide Film----[[LIREN ELECTRICAL INSULATION MATERIALS]]
Javascript DHTML Drop Down Menu Powered by dhtml-menu-builder.com
 
>>Product Show
  >> AL Aluminum Metallized Polyimide Film  
 

AL Aluminum Metallized Polyimide Film

 

Description:

AL Aluminum Metallized Polyimide Film consists of a polyimide film coated with aluminum on one side. It not only has excellent low and high temperature resistance, solvent resistance, radiation resistance, and flame resistance, but also has EMI shielding and high thermal conductivity.

Characteristics

 • EMI shielding

 • High thermal conductivity

 • Good radiation resistance

 • High temperature resistance

Application:

AL Aluminum Metallized Polyimide Film can be used in a wide range of industries where EMI shielding and efficient thermal energy transfer are required.

EMI Shielding Materials

• Conductive Materials

• Military applications

• Satellite and Space applications

Technical Data:

Property

Units

Aluminum Metallized Polyimide Film Typical Value

LR-PI 100AM

LR-PI 200AM

Backing Thickness

m

25

50

Aluminum Thickness

m

0.2-0.5

0.2-0.5

Tensile Strength

MPa

140

130

Elongation

%

45

45

Shrinkage, at 150

%

0.20

0.20

Surface Resistivity

The side of PI Film

1X1012

1X1012

The side of Aluminum

<103

<103

Roll Size: 3" paper or plastic core, from 6mm width upward, standard width 520mm.

Special thickness or combinations can be supplied per customers request

 

 

Note: The technical information, data, recommendations, and other statements provided are based on tests or research which we believe to be reliable, but such information shall in no event constitute a warranty of any kind by Liren. Before using this product, all purchasers should carefully evaluate its suitability for their intended applications.

 

Click Count3580  Input Time2014-11-02 HOME